US
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US Patent 9,018,662
MULTICHIP PACKAGE STRUCTURE US-I-9018662.pdf
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US Patent 9,029,883
LED PACKAGE STRUCTURE WITH CONCAVE AREA FOR POSITIONING HEAT-CONDUCTING SUBSTANCE US-I-9029883.pdf
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US Patent 9,125,328
MULTICHIP PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME US-I-9125328.pdf
