Invention

  • US-I-9825015

    LIGHT-MIXING MULTICHIP PACKAGE STRUCTURE US-I-9825015.pdf

  • US-I-9803846

    CIRCUIT SUBSTRATE FOR CARRYING AT LEAST ONE LIGHT-EMITTING DIODE AND LIGHT-EMITTING STRUCTURE FOR PROVIDING ILLUMINATION US-I-9803846.pdf

  • CN-I-2013104070649

    多芯片封装结构 CN-I-201310407064.pdf

  • US-I-9451662

    ALTERNATING CURRENT LIGHT EMITTING DEVICE US-I-9451662.pdf

  • US-I-9433103

    METHOD OF MANUFACTURING A MULTICHIP PACKAGE STRUCTURE US-I-9433103.pdf

  • TW-I-518955

    多晶片封裝結構 TW-I-518955.pdf

  • US-I-9018662

    MULTICHIP PACKAGE STRUCTURE US-I-9018662.pdf

  • CN-I-2012101722699

    节能照明装制及其方法 CN-I-2012101722699.pdf

  • JP-I-5290101

    複数個の予備のはんだパッドを備えてワイヤボンディングの歩留りを高める発光ダイオードの実装構造とその製造方法 JP-I-5290101.pdf

  • KR-I-10-1073696

    연색성과 휘도를 향상시키는 혼합광식 엘이디 패키지 구조 KR-I-10-1073696.pdf



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