Patents Granted
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US Patent 9,029,883
LED PACKAGE STRUCTURE WITH CONCAVE AREA FOR POSITIONING HEAT-CONDUCTING SUBSTANCE US-I-9029883.pdf
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US Patent 9,125,328
MULTICHIP PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME US-I-9125328.pdf
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10880285
Paragonled-CN-09
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10880284
Paraled-CN-09
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10880281
Seriled-CN-09
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10880282
Voled-CN-09
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10880283
Voled-CN-11
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10832079
Seriled-EU
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10832129
Voled-EU
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TW-I354365
能夠提高演色性及亮度之混光式發光二極體封裝結構 TW-I-354365.pdf
