Patents Granted

  • US Patent 9,029,883

    LED PACKAGE STRUCTURE WITH CONCAVE AREA FOR POSITIONING HEAT-CONDUCTING SUBSTANCE US-I-9029883.pdf

  • US Patent 9,125,328

    MULTICHIP PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME US-I-9125328.pdf

  • 10880285

    Paragonled-CN-09

  • 10880284

    Paraled-CN-09

  • 10880281

    Seriled-CN-09

  • 10880282

    Voled-CN-09

  • 10880283

    Voled-CN-11

  • 10832079

    Seriled-EU

  • 10832129

    Voled-EU

  • TW-I354365

    能夠提高演色性及亮度之混光式發光二極體封裝結構 TW-I-354365.pdf



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