Patents Granted
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CN201620240120.3
混光式多芯片封装结构 CN-M-2016202401203.pdf
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US Patent 9,433,103
METHOD OF MANUFACTURING A MULTICHIP PACKAGE STRUCTURE US-I-9433103.pdf
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US Patent 9,018,662
MULTICHIP PACKAGE STRUCTURE US-I-9018662.pdf
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Nr-202016102491
Lichtmischungs-Multichip-Gehäuseanordnung DE-M-202016102491.pdf
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Nr-202015106471
Lichtemittierende Vorrichtung DE-M-202015106471.pdf
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TW-M516235
混光式多晶封裝結構 TW-M-516235.pdf
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TW-M516136
交流電發光二極體燈具結構 TW-M-516136.pdf
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TW-M515250
交流發光裝置 TW-M-515250.pdf
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TW-M514544
發光二極體照明裝置 TW-M-514544.pdf
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TW-I518955
多晶片封裝結構 TW-I-518955.pdf
